Small outline package 1mm. For more information, see Texas Instruments literature Small-Outline No-Lead Package (SON) Variants Different chip manufacturers use different names for this package: ML (micro-leadframe) versus FN (flat no-lead) , in addition there are versions with pads on all four sides (quad) and pads on just two sides (dual), thickness varying between 0. Sep 17, 2023 · SOP（Small Outline Package）是一种低端的封装形式，多用于低端芯片和低端电子元器件，其封装体积较大，封装引脚数量较少。 SOT（Small Outline Transistor）是一种比SOP更加紧凑的封装形式，其封装体积更小，封装引脚数量更少，多用于中高端芯片和电子元器件。 The Very Small Outline Package, or VSOP, is one of several smaller versions of the SOIC package, having a compressed body and a tightened pitch for its gull wing leads. MSOP (Mini Small Outline Package): This is a larger version of the SOP package with a lead pitch of 1. Their height is similar to Mar 14, 2017 · Thermally Enhanced Small-Outline Package: MSOP: Mini Small-Outline Package: PSOP: Plastic Small-Outline Package: PSON: Plastic Small-Outline No-Lead Package: QSOP: Quarter-Size Small-Outline Package: SOIC: Small Outline Integrated Circuit: Also known as SOIC NARROW and SOIC WIDE. plastic, small outline package; 16 leads; 1. Nov 30, 2017 · By Prasad Tota and Robert Day Throughout the electronics industry, submicron feature size at the die level are driving package component sizes down to the design-rule level of the early technologies. This package is designed to be soldered to a thermal pad on the board. Due to their low cost and low profile, SOT's are widely used in consumer electronics. They typically feature gull-wing leads for surface mounting, ensuring secure connections while optimizing board space. SOP，SOT，SOD Oct 27, 2017 · III. 65mm, 0 Small Outline Integrated Circuit Package (SOIC) The SOIC package is a surface mounted device designed to meet the demand for increasing miniaturization and component density. There are several variations of SOIC packaging, including Small Outline J-Lead (SOJ), Mini Small Outline Package (MSOP), Shrink Small Outline Package (SSOP), and Thin Small Outline Package (TSOP). The SOIC package is a rectangular "Dual In-line" style ceramic package. 54 mm, 1. Package summary Mar 28, 2018 · TSOP (Thin Small Outline Package)： pin脚间距：1. . , diodes) and ICs. The thick Copper (cu) heat sink is mechanically attached to the package’s lead frame just to improve the thermal performance. Here are some of the additional information about HSOP’s heat sink: Mechanical Attachment. Another smaller version of the SOIC is the SSOP . Nexperia SOT8062-1 Plastic, thermal enhanced thin shrink small outline package; 8 leads, 0. Types of SOT Packages (not shown in scale) The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. These Small Outline Packages give users strong packaging choices for all types of applications. Apr 26, 2024 · Types of Small Outline Packages Thin Small Outline Package (TSOP): TSOPs are characterized by their extremely thin profile, making them suitable for applications where height constraints are critical. The SOJ is also sometimes referred to as 'SOIJ', or J-leaded small outline IC package. Small Outline Package (SOP): A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. 65mm（26mil） 薄的缩小外形封装，薄体的脚是密脚的。 SOL (Small Out-Line L-leaded pack age) 按照JEDEC 标准对SOP 所采用的名称。 May 31, 2023 · SOP (Small Outline Package) is a type of integrated circuit package that features a compact and thin design, typically used for surface-mount applications. SOIC Small Outline Integrated Circuit 甚小外形封装 VSSOP Very Shrink Small Outline Package 甚缩小外形封装 TSOP Small Outline Package 薄小 plastic, very thin shrink small outline package; 8 leads; 0. QSOP (Quarter Small Outline Package): This is a smaller version of the SOP package with a lead count of 8-16; SOP packages are used in a wide range of applications, including consumer electronics, telecommunications, and SOP （Small Out-Line Package小外形封装）是一种很常见的元器件形式。表面贴装型封装之一，引脚从封装两侧引出呈海鸥翼状(L 字形)。 表面贴装型封装之一，引脚从封装两侧引出呈海鸥翼状(L 字形)。 Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two long sides. The SOT-23 and the SC-70 packages are two of the most Apr 13, 2023 · What is a SOIC package? The Small Outline Integrated Circuit (SOIC) package is a type of surface-mount IC package that is widely used in the electronics industry. 请注意，JEDEC标准中所称的“SOP”具有不同的宽度. May 31, 2023 · SOP (Small Outline Package) is a type of integrated circuit package that features a compact and thin design, typically used for surface-mount applications. Jun 5, 2023 · SOP（Small Outline Package）：它通常具有直线或弯曲排列的引脚，引脚数一般为8至48个。 SOP封装在尺寸上比SOIC封装更小，适合于空间有限的应用。 SSOP（Shrink Small Outline Package）：这是一种缩小型的SO封装，它的引脚间距和尺寸比SOIC和SOP封装更小，通常用于要求更高 Small Outline Package 小外形封装。在EIAJ标准中，针脚间距为1。27mm（50mil)的此类封装被称为“SOP”. 051 in). Statistically controlled and refined assembly processes coupled with very high quality materials assure the best SOP packages available for your semiconductor devices. It is one of the most commonly used surface mount packages today. It is a type of IC package with the heat sink attached right on the lead frame. 27mm, 1. 5 mm x 2. SFA SEMICON’s broad portfolio of Small Outline Package (SOP) include the popular “gullwing” lead formats. 9 mm x 1. Muchos ejemplos de oraciones traducidas contienen “small outline package” – Diccionario español-inglés y buscador de traducciones en español. Package outline UNIT A1 A2 A3 bp c D(1) E(2) e HE L Lp v w y θ SOP（Small Outline Package）封装和SOIC（Small Outline Integrated Circuit）封装之间的差异相对细微，实际上，SOIC 是 SOP 的一种具体类型。以下是它们的细微差别及是否可以混用的分析： 1. Therefore, "Low-Profile Small Outline Non-leaded package (LSON)" is a SON with a package installation height of "1. 4mm and 6. (6) TO (transistor outline) package is commonly used to medium and high power devices electronics (e. The pin pitch of the Small Outline Package (SOP) is 50 mils (1. The . Jan 27, 2021 · 1、 SOP封装SOP是英文Small Outline Package的缩写，即小外形封装。SOP封装技术由1968～1969年菲利浦公司开发成功，以后逐渐派生出SOJ（J型引脚小外形封装）、TSOP（薄小外形封装）、VSOP（甚小外形封装）、SSOP（缩小型SOP）、TSSOP（薄的缩小型SOP）及SOT（小外形晶体管）、SOIC（小外形集成电路）等。 MSOP(Mini Small Outline Package or Micro Small Outline Package)はピンピッチが 0. 635 mm (0. 4 mm x 7. 업계 표준 패키지는 대량 양산되고 있으며, 다양한 애플리케이션에 저비용 고부가가치 솔루션을 제공합니다. Package type descriptive code SO14 Package type industry code SO14 Package style descriptive code SO (small outline) Package body material type P (plastic) IEC package outline code 076E06 JEDEC package outline code MS-012 Mounting method type S (surface mount) Issue date 19-02-2003 Manufacturer package code 98ASA01365D Table 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP48 Package type industry code TSSOP48 Package style descriptive code TSSOP (thin shrink small outline package) Package body material type P (plastic) JEDEC package outline code MO-153 Mounting method type S (surface mount) Number of package outline detail Ceramic Small Outline Package (CSOP) Classification : Product center The Ceramic Small Outline Package (CSOP) is a common surface mount package, with leads from both sides, and the lead spacing is 2. 0mm, 0. Nov 19, 2024 · A Small Outline Integrated Circuit (SOIC) is a surface-mount IC package that offers a compact size and good electrical performance. Since Small Outline Transistor (SOT) is a surface mount package developed for transistors, there are many 3-pin SOT. 00 mm (0. 15 per side. May 31, 2023 · SOP stands for Small Outline Package and is an integrated circuit (IC) package that provides a compact and thin form factor for electronic components. 10 (0. Thin small outline package (TSOP) is a type of surface mount IC package. They can have a few different variants: SSOP Packages: SSOPs, or shrink small outline packages, have a pin pitch of 0. 보다 넓은 의미로 보면 SOIC Package라고 말합니다. 1. , lighting equipment, switching power supply, microwave ovens, electric cars). plastic, shrink small outline package; 28 leads; 0. 35 mm body 8-bit 25 mA Voltage switch LED Driver with 400kHz I2C interface in SO16 Aug 10, 2001 · SOP (Small Outline Package)에 대하여 알아봅니다. [4] 0. 5mm のSOPです。 メーカーによって様々な表記方法があり、Analog Devices社は micro SOIC 、Maxim社は SO/uMAX 、National Semiconductor社は MiniSO と表記することがあります。 Dec 30, 2024 · SOP（Small Outline Package）封裝和SOIC（Small Outline Integrated Circuit）封裝之間的差異相對細微，實際上，SOIC 是 SOP 的一種具體類型。 以下是它們的細微差別及是否可以混用的分析： 1. AN2409, Small Outline Integrated Circuit (SOIC) Package The Plastic Small Outline Package (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface mount memory packaging from Intel. Table 1. The TSSOP come in body sizes of 3. Shrink Small Outline Package (SSOP) is a smaller or ‘shrunk’ version of the SOIC package, having a compressed body and a tightened lead pitch. It was first introduced by the electronics company Texas Instruments in 1985. 封装定义: SOP (Small Outline Package): 是一种表面贴装的封装类型，具有扁平、较小的外形。 The Micro Small Outline Package, or micro-SOP or MSOP, is a very small rectangular plastic package with gull wing leads protruding out of its longer sides. Jul 17, 2023 · SSOP（Shrink Small Outline Package）封装和SOP（Small Outline Package）封装是两种常见的表面贴装封装类型。虽然它们在名称上很相似，但在尺寸、引脚密度和应用领域等方面存在一些区别。 Oct 23, 2024 · The Small Outline Integrated Circuit (SOIC) package is one of the most popular and widely used surface mount package types in integrated circuits. It is designed to be surface mounted on a printed circuit board (PCB), offering the advantages of space efficiency and ease of manufacturing. 3 mm x 2 mm body. This package uses perimeter lands on the bottom of the package to provide electrical contact to the printed circuit board. This is true for DIP components, QFN components, and small outline transistor (SOT) package types. With electronics transitioning to smaller sizes and higher component density on printed circuit boards, SOIC packaging has become one of the enabling technologies. Nexperia SOT137-1 plastic, small outline package; 24 leads; 1. g. 36 - mm package width The Power Small Outline Package, or PSOP, is a rectangular small outline IC package developed by Amkor that integrates a copper heat slug in its plastic body. 008)M 0. Mold flash, protrusions or gate burrs shall not exceed 0. 65 mm (0. Table 1 below shows the various types of SOT packages. 8 mm x 4. 85 mm. 70mm". 65mmもしくは0. 3 SON and QFN packages 3. Package summary SOP (Small Outline Package)에 대하여 알아봅니다. 27mm (50mil)的此类封装被称为“SOP”。 请注意，JEDEC 标准中所称的“SOP”具有不同的宽度。 S Thin small outline package (TSOP) Thin-shrink small outline package (TSSOP) Shrink small-outline package (SSOP) Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0. Soldering Footprint information for reflow soldering of HTSSOP8 package SOT8062-1 SOIC(Small Outline IC Package)는 최적의 성능을 요구하는 IC 애플리케이션에 적합한 리드프레임 기반 플라스틱 성형 패키지입니다. The MSOP is a miniaturized version of the SSOP package, having a smaller footprint than the latter. The pins are drawn in an L shape from both sides of the body, with the leads extending from the longer edge of the package. SOP（Small Outline Package）小外形封装，指鸥翼形(L形)引线从封装的两个侧面引出的一种表面贴装型封装。 1968～1969年飞利浦公司就开发出小外形封装（SOP）。 Plastic Packages for Integrated Circuits Package Outline Drawing M28. It has a smaller body and smaller lead pitch than the standard SOIC package. There are various types of Small Outline Diode (SOD) such as "SOD-123", "SOD-323F", and "SOD-523" depending on the package size and lead shape. 특별히 편평도(flatness), 코플래너러티 Types of Small Outline Non-leaded package (SON) LSON. 039 in). Legal information Definitions Draft — The document is a draft version only. 00mm, 0. 27 millimeters. SOICs are widely used in various electronic applications, such as consumer electronics, automotive systems, and industrial equipment. The leads protrude from the longer edge of the package. Today’s integrated circuit (IC) package technology must deliver higher lead counts, reduced lead pitch, minimum footprint area, and significant Plastic Packages for Integrated Circuits Small Outline Transistor Plastic Packages (SOT23-8) D e1 E CL e b CL A A2 A1 CL 0. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1. The s mall outline transistor (SOT) package family consists of many types of very small and inexpensive surface-mount packages used for discrete components and simple IC's. 图为SOT-23封装 3、SOD. Small Outline Package (SOP) is a gull wing (L-shaped) package with leads coming out of two sides of the package. Package type descriptive code SO8 Package type industry code SO8 Package style descriptive code SO (small outline) Package body material type P (plastic) Mounting method type S (surface mount) Issue date 01-02-2016 Manufacturer package code 98ARH99066A Table 1. Package summary Package type descriptive code SO14 Package type industry code SO14 Package style descriptive code SO (small outline) Package body material type P (plastic) IEC package outline code 076E06 JEDEC package outline code MS-012 Mounting method type S (surface mount) Issue date 19-02-2003 Manufacturer package code 98ASA01365D Table 1. The SOIC package is a rectangular plastic package with leads on two sides. 173 28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 1, 5/10 DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN TOP VIEW SIDE VIEW END VIEW Dimension does not include mold flash, protrusions or gate burrs. 3 mm (0. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. 80mm and 0. It is a surface mount package with metallized terminal pads located at the bottom surface of the package. 2 mm x 5. 60mm, etc. The number after SOP indicates the number of pins. Package summary Terminal position code D (double) Package type descriptive code VSSOP8 Package type industry code VSSOP8 Package style descriptive code VSSOP (very thin shrink small outline package) Small Outline J-leaded package DIPよりも基板上での占有面積を小さくするために開発されました。 パッケージ長辺の両側からリードが出ており、先端がパッケージ本体を抱え込むように、内側に曲がっているタイプです。 Jul 4, 2023 · TSSOP (Thin Shrink Small Outline Package)：TSSOP封装是一种薄型尺寸较小的SSOP封装。它具有非常紧凑的引脚布局和较小的封装尺寸，适用于高密度、小型化的应用。 SOT (Small Outline Transistor)：SOT封装主要用于晶体管器件的封装。 The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions [1] and 3mm × 4mm for the 12 and 16 pin version. Small Outline Packages, or SOPs, represent a notable advancement in surface-mount technology (SMT) for packaging integrated circuits (ICs). May 29, 2023 · SSOP（Shrink Small Outline Package）封装是一种集成电路（IC）封装的类型。它是一种小型封装，常用于高密度和小型化的电子设备中，如移动电话、数码相机、便携式音频播放器等。 SSOP封装是一种表面贴装封装，也被称为SMT（Surface Mount Technology）封装。 Nexperia SOT355-1 plastic, thin shrink small outline package; 24 leads; 0. It is also smaller and thinner than a TSOP with the same lead count. The pin pitches include 1. 25 (0. 27mm（50mil） 薄小外形封装，薄体的脚，间距正常的。 TSSOP (Thin Shrink Small Outline Package) pin脚间距：0. SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. Find the Small Outline (SO) package drawing and specifications such as pin count, pitch and dimension. 27 mm pitch; 15. The "L" in front of SON means that the package installation height L is "1. 9 mm x 3. SOJ: J-leaded a 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Feb 25, 2021 · These SOT package types are very similar, but they need different footprints and land patterns for use in CAD tools. Micro lead frame (MLF) is a near CSP plastic encapsulated package with a copper leadframe substrate. It provides a standardized form factor and layout for electronic components, facilitating efficient assembly and integration into electronic devices. 20 (0. The ' Small Outline Integrated Circuit', or SOIC, is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads. Aug 12, 2020 · SOP（Small Outline Package）小外形封装 ，指鸥翼形(L形)引线从封装的两个侧面引出的一种表面贴装型封装 。 1968～1969年飞利浦公司就开发出小外形封装（SOP） 。 Nov 28, 2023 · (5) SOT (small-outline transistor) package is commonly used to medium and low power tubes of electronics (e. 0mm for normal packages and 0. 7. The concept of Small Outline Packages (SOPs) has dramatically transformed the landscape of integrated circuits by providing a compact and versatile packaging solution for electronic components. SOP Packages. It is characterized by its compact size and space-saving design, making it suitable for applications where board space is limited. 65 mm pitch; 7. The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. May 30, 2023 · SOP：小外形封装（Small Outline Package） SOT：小外形晶体管（Small Outline Transistor） SOD：小外形二极管（Small Outline Diode） DO：二极管（diode） 二、举例说明 1、SOP. Package summary Parameter Min Nom Max Unit package length - 7. SOT packages offer provisions for surface mounting, which can be valuable in improving their assembly related efficiency. Typically named SOIC-n where n= number of pins. DMB/PWSON and DOD are common seen WSONs from Texas Instruments. May 27, 2023 · SOP（Small Outline Package）：这是最常见的SOP封装类型，引脚位于封装的两侧，通常是直插式的。它有多个变种，如SOP8、SOP16、SOP20等，数字表示引脚数量。SOP封装通常用于低功耗和小尺寸的集成电路。 SMALL OUTLINE PACKAGE 4226366/A 10/2020 NOTES: (continued) 6. 8mm, 0. 27mm). Like other surface-mount ICs, SOIC is mounted on the surface of a PCB using SMT (Surface Mount Technology), featuring a smaller footprint and higher pin density. Package Version Package Name Mount Terminal Position Package Style WSON is Plastic Small-Outline No-Lead (SON) Package defined by JEDEC. SOP(Small Outline Package)の特長 特長：小ピン～中ピンクラスラインアップ、標準パッケージ 構造：リードがパッケージの2側面から取り出され、且つガルウイング形に成形されたパッケージ Oct 9, 2022 · Its full name is Heat Sink Small Outline Package. 70mm ". 6 mm (0. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. 65 mm body 4. 5 mm lead spacing is less common, but not rare. SOD stands for "Small Outline Diode". Currently, Small Outline Transistor (SOT) is used not only for transistors but also for other semiconductors (e. Shrink SOP is leadframe based, plastic encapsulated package that are well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0. Characteristics of Small Jul 18, 2023 · 这几个常见封装有细微区别 SOP (Small Outline Package): pin脚间距：1. Nov 6, 2015 · Thin Small Outline Package (TSOP) 앰코는 IC 디자이너, PCB/시스템 엔지니어, 부품 전문가들의 필요를 만족시키기 위해 유명한 TSOP 1 패키지의 다양한 형태를 제공합니다. 1 Package description The small outline no-lead (SON)/quad flat no-lead (QFN) is a small size, lead-less plastic package with a low profile, moderate thermal dissipation, and good electrical performance. 65 mm pitch; 10. 5 mm pitch; 2 mm x 2. 4 mm x 1. 27mm. 9-1. The most common SOT are SOT23 variations,. For more information, see Texas Instruments literature Ceramic Small Outline Package (CSOP) National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. 064 8 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE De thin shrink small outline package is geschikt voor toepassingen die 1 mm of minder montagehoogte vereisen, heeft een kleinere behuizing en kleinere lead-pitch dan een standaard SOIC ic-behuizing. Jan 2, 2025 · 1、 SOP封装SOP是英文Small Outline Package的缩写，即小外形封装。SOP封装技术由1968～1969年菲利浦公司开发成功，以后逐渐派生出SOJ（J型引脚小外形封装）、TSOP（薄小外形封装）、VSOP（甚小外形封装）、SSOP（缩小型SOP）、TSSOP（薄的缩小型SOP）及SOT（小外形晶体管）、SOIC（小外形集成电路）等。 Package type descriptive code SO8 Package type industry code SO8 Package style descriptive code SO (small outline) Package body material type P (plastic) IEC package outline code 076E03 JEDEC package outline code MS-012 Mounting method type S (surface mount) Issue date 18-02-2003 Manufacturer package code 98ASA01364D Table 1. 0mm 패키지는 다양한 환경에서도 안정적으로 작동할 수 있도록 설계된 제품입니다. They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. small-outline package A package whose chip cavity or mounting area occupies a major fraction of the package area and whose terminals are on one or two (normally opposite) sides and consist of metal pad surfaces (on leadless versions) or leads formed around the sides and under the package or extending out from the package (on leaded versions). You can never tell exactly what function a component provides just by looking at its package. 0256 inches) or 0. Jan 20, 2024 · SOP-8（Small Outline Package）和SOIC-8（Small Outline Integrated Circuit）都是常见的集成电路封装类型，它们都具有8个引脚，适用于表面贴装技术。在尺寸和引脚间距上，它们通常非常相似，常见的引脚间距都是1. 图为SOP-20封装 2、SOT. MLPD are designed to provide a footprint-compatible replacement for small-outline integrated circuit (SOIC) packages. They are suitable for high density thanks to their compact form. 0mm, 4. It is available in two materials: plastic and ceramic. 27mm 正常的贴片厚度和脚的间距，小外形封装。在EIAJ 标准中，针脚间距为1. [ 1 ] SOT23-5 differs from SOT23 in a wider body of 1. 27mm。 Jun 30, 2021 · Shrink Small Outline Package; Thin Shrink Small Outline Package; Quarter-size Small Outline Package; Very Small Outline Package; QFP (Quad Flat Package) From four sides the leads are led out in an L-shape, plastic packaging accounts for the vast majority of the other materials are ceramic, metal. 27 mm pitch; 9. For more information, see Texas Instruments literature Jun 9, 2023 · What is a Small Outline Integrated Circuit (SOIC) A Small Outline Integrated Circuit (SOIC) is a type of surface-mount electronic component package used for integrated circuits (ICs). Mar 4, 2025 · SOIC, whose full name is Small Outline Integrated Circuit, is a type of chip package designed to replace the traditional DIP (Dual In-line Package). The ' Small Outline J-Lead Package', or SOJ, is a small rectangular surface-mount plastic-molded integrated circuit package with J-formed leads. SOP（Small Outline Package）型およびSOIC（Small Outline Integrated Circuit）型は、いずれも表面実装技術におけるパッケージングの種類であり、基本的に集積回路をパッケージングするために使用されます。ただし、パッケージング構造とピン配置が異なります。 Viele übersetzte Beispielsätze mit "small outline package" – Deutsch-Englisch Wörterbuch und Suchmaschine für Millionen von Deutsch-Übersetzungen. The die is attached to this heat slug, increasing the chip's ability to dissipate heat and thus handle more power. 1 mm body 3. 3 mm x 1 mm body 3 June 2022 Package information 1. In addition they support the widest range of nonvolatile memory component SMALL OUTLINE PACKAGE 4226367/A 10/2020 NOTES: (continued) 6. SOPs or Small Outline Packages are surface-mount packages that are smaller than SOIC packages and with pin pitches lesser than 1. Wikepedia에서는 SOIC(Small Outline Integrated Circuit) Package 중 하나로 소개하고 있습니다. , mobile phones, notebook computers). [2] [3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability. Highlights • Higher density SMALL OUTLINE PACKAGE 4226366/A 10/2020 NOTES: (continued) 6. They are available in many configurations including MSOP, VSOP, SSOP and TSSOP with body sizes ranging from 150 - 300mils. 65 mm pitch, 3 mm × 3 mm × 1. 작고 얇은 이 1. It varies from various pins, similar to SOIC , but generally with 8 pins (all also have exposed thermal pads ). This IC package is typically transported in the form of reels or tubes. 0098) Value-added, low-cost packaging solutions. 004)C C-C-SEATING PLANE 1234 876 5 CL E1 C VIEW C VIEW C L R1 R 4X θ1 4X θ1 GAUGE PLANE L1 SEATING C α L2 PLANE c BASE METAL WITH c1 PLATING b1 b P8. Small Outline Package Small Outline Packages (SOP) are industry proven surface mount leadframe packages with a body size and height smaller than DIP packages and a tighter leadframe pitch. 063 in) instead of 1. May 29, 2023 · A small outline package (SOP) is one of the surface-mount packaging types, with pins extending from both sides of the package in the shape of seagull wings (L-shape). [1] Some versions have an exposed pad on the bottom side. 5mm). SOT stands for "Small Outline Transistor". 20mm < L ≤ 1. Publication IPC-7351 may have alternate designs. For example, SOP8 means a 8-pin SOP. 65 mm to 1. The leads are […] The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch. 图为SOD-123封装 4、DO. 2 mm body 2. IC는 고도로 직접된 Integrated Circuit의 약자입니다. Jun 29, 2016 · 1、 SOP封装 SOP是英文Small Outline Package的缩写，即小外形封装。SOP封装技术由1968～1969年菲利浦公司开发成功，以后逐渐派生出SOJ（J型引脚小外形封装）、TSOP（薄小外形封装）、VSOP（甚小外形封装）、SSOP（缩小型SOP）、TSSOP（薄的缩小型SOP）及SOT（小外形晶体管）、SOIC（小外形集成电路）等。 Nov 2, 2023 · The standard pin pitch for SOIC is 50 mils or 1. COMPLIANT TO JEDEC STANDARDS MS-012-AA 012407-A 0. SSOP lead counts range from 8 to 64. Oct 29, 2024 · Small-Outline Transistor (SOT) SOT packages are small available for transistors and diodes and used in power control and switching application. 65mm which is almost half of the SOIC package. The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. De TSSOP is ook kleiner en dunner dan een TSOP met hetzelfde aantal pinnen. 图为DO-14封装 三、归纳总结. SOD is the name of the package for surface mounting of diodes. Mar 31, 2023 · The small outline package, called 'Small Outline Integrated Circuit', or SOIC, is a small rectangular surface-mount package with gull-wing leads and either plastic or ceramic molding. 025 inches ). 4mm for extremely thin.
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